Multi-level electro-thermal modeling for circuit simulation of packaged power devices

  title={Multi-level electro-thermal modeling for circuit simulation of packaged power devices},
  author={Alberto Castellazzi and Mauro Ciappa},
  journal={2008 11th Workshop on Control and Modeling for Power Electronics},
This paper explores a coupled electro-thermal modeling approach based on the integration of analytical compact models of semiconductor physics with a distributed three-dimensional description of thermal phenomena. The main motivation for the development of novel approaches resides in the increasing integration level of power components and equipment, which is pushing the validity of essentially-1D compact thermal models (i.e., RC-Networks) to their limit. Distinctive features of the proposed… CONTINUE READING
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