Multi-lead organic air-cavity package for high power high frequency RFICs

@article{Dougherty2009MultileadOA,
  title={Multi-lead organic air-cavity package for high power high frequency RFICs},
  author={David S Dougherty and Mali Mahalingam and Vish Viswanathan and Mike Zimmerman},
  journal={2009 IEEE MTT-S International Microwave Symposium Digest},
  year={2009},
  pages={473-476}
}
A new air cavity package has been developed and qualified for packaging high power RF components. The package uses the standard outline of a conventional ceramic package. The ceramic dielectric is replaced with a novel high performance thermoplastic which is a modified Liquid Crystal Polymer. The package manufacturing technology provides for a cost effective means of creating a package with multiple leads. Such package is advantageous in the cellular base station market for high electrical and… CONTINUE READING