Multi-layer electroplated micro-spring array for MEMS probe card

A MEMS probe card consisting of micro-springs arranged in 250-/spl mu/m-pitch array has been presented. Three-dimensional 'S shape' spring structure was designed and fabricated directly on a circuit board by a newly developed multi-layer Ni electroplating process. Mechanical properties of the micro-springs were measured and no fracture or deformation were… CONTINUE READING