Monitoring of Epoxy Curing by a Thermal-Conductivity Sensor Based on the Hot-Ball Transient Method

@article{Kubir2012MonitoringOE,
  title={Monitoring of Epoxy Curing by a Thermal-Conductivity Sensor Based on the Hot-Ball Transient Method},
  author={L’udov{\'i}t Kubi{\vc}{\'a}r and Carlos Calvo Anibarro and Viliam Vreten{\'a}r and Peter Die{\vs}ka and Igor Nov{\'a}k and Ivan Chod{\'a}k},
  journal={International Journal of Thermophysics},
  year={2012},
  volume={33},
  pages={1164-1176}
}
Epoxy resins are materials capable of polymerizing under certain conditions, i.e., a temperature and the presence of a hardener, yielding a three-dimensional net formed by the crosslinking of the chains. This polymerization is also called the curing process. During the curing, different physical processes can be detected, namely, formation of polymer chains and their crosslinking. Thermodynamic and transport characteristics change markedly. A new thermal-conductivity sensor was used for… CONTINUE READING