Molecular dynamics simulations of thermal resistance at the liquid-solid interface.

@article{Kim2008MolecularDS,
  title={Molecular dynamics simulations of thermal resistance at the liquid-solid interface.},
  author={Bo Hung Kim and Ali Beskok and Tahir Çagin},
  journal={The Journal of chemical physics},
  year={2008},
  volume={129 17},
  pages={174701}
}
Heat conduction between parallel plates separated by a thin layer of liquid Argon is investigated using three-dimensional molecular dynamics (MD) simulations employing 6-12 Lennard-Jones potential interactions. Channel walls are maintained at specific temperatures using a recently developed interactive thermal wall model. Heat flux and temperature distribution in nanochannels are calculated for channel heights varying from 12.96 to 3.24 nm. Fourier law of heat conduction is verified for the… CONTINUE READING
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