Molded underfill for flip chip package

Abstract

Air trap (Void) in a molded underfill package always exists. It is an annoying problem and needs further investigation. In this research, the mold filing phenomenon of molded underfill (MUF) was investigated through numerical method. The carrier was a flip chip (FC) package. Moldex3D software was used as the tool. The resin was modeled as a reaction fluid… (More)

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