Modeling temperature distribution in Networks-on-Chip using RC-circuits

@article{Tockhorn2010ModelingTD,
  title={Modeling temperature distribution in Networks-on-Chip using RC-circuits},
  author={Andreas Tockhorn and Claas Cornelius and Hagen S{\"a}mrow and Dirk Timmermann},
  journal={13th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems},
  year={2010},
  pages={229-232}
}
As transistor dimensions are shrinking into regions of only a few atomic layers, designers are faced with various problems including increased reliability and power issues. Since these problems are amplified by higher circuit temperatures, this paper proposes an approach for the fine-grained modeling of temperature distribution in many-core systems based on… CONTINUE READING