Modeling of integrated microstrip bend structures on silicon substrates up to 110 GHz

This work describes an equivalent circuit model for microstrip bend structures on silicon substrates targeted for integrated millimeter wave circuits. The values of the lumped elements are extracted from 3D electromagnetic simulations for three different bend shapes and strip widths in the range of W=5-50 µm up to 110 GHz. The width dependence of the… (More)