Corpus ID: 204839259

Modeling of Via Interconnect through Pad in Printed Circuit Board

@inproceedings{Ghosh2019ModelingOV,
  title={Modeling of Via Interconnect through Pad in Printed Circuit Board},
  author={A. Ghosh and S. Das},
  year={2019}
}
─ In this paper the methods of finding inductance L of a cylindrical via and capacitance C due to via pad in printed circuit board (PCB) are described. Initially a thin cylindrical via of diameter d without pad is connected between a 50 ohm copper trace on the top of a dielectric substrate and a ground plane at the bottom. The line is terminated with matched load. The geometrical structure is simulated using Ansoft HFSS software tools to find the input reflection coefficient S11. The value of… Expand

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