Modeling and characterization of the bonding-wire interconnection for microwave MCM

@article{Ying2010ModelingAC,
  title={Modeling and characterization of the bonding-wire interconnection for microwave MCM},
  author={Liang Ying and Huang Chunyue and Wang Wangang},
  journal={2010 11th International Conference on Electronic Packaging Technology & High Density Packaging},
  year={2010},
  pages={810-814}
}
The 3-D electromagnetic software Ansoft HFSS is adapted to modeling analysis and simulation optimization about the microwave characteristics of bonding interconnection in the MMCM. The gold bond model contained micro strip is set up to emulate and optimize for insertion loss (IL) and return loss (RL), according to the major parameters such as arch highness, span and the root of the number of gold. Micro strip model of three roots copper wire connection is established to analyses the difference… CONTINUE READING
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References

Publications referenced by this paper.
Showing 1-5 of 5 references

Parameters Extraction and Optimization of Bondwire in MMCM[J

Zeng Genghua, Tang Gaodi
Information and Electronic Engineering, • 2007
View 1 Excerpt

Microwave Characteristics of Bonding Interconnects in LTCC Microwave MCM

Yan Wei, Fu Peng, Hong Wei
Journal of Microwaves, • 2003
View 1 Excerpt

Interconnects and Transitions in Multilayer LTCC Multichip Modules for 24 GHz ISM - Band Applications

W Simon, R Kulke, M Wien
IEEE MTT2S • 2000

Optimum Microstrip Interconnects

Steve Nelson, Marilyn Youngblood, Jeanne Pavio
IEEE MTT2S • 1991
View 1 Excerpt

Simple Equations Characterize Bond Wires

Steven L March
Microwaves & RF , • 1991
View 1 Excerpt

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