Modeling and characterization of the bonding-wire interconnection for microwave MCM

  title={Modeling and characterization of the bonding-wire interconnection for microwave MCM},
  author={Liang Ying and Huang Chunyue and Wang Wangang},
  journal={2010 11th International Conference on Electronic Packaging Technology & High Density Packaging},
The 3-D electromagnetic software Ansoft HFSS is adapted to modeling analysis and simulation optimization about the microwave characteristics of bonding interconnection in the MMCM. The gold bond model contained micro strip is set up to emulate and optimize for insertion loss (IL) and return loss (RL), according to the major parameters such as arch highness, span and the root of the number of gold. Micro strip model of three roots copper wire connection is established to analyses the difference… CONTINUE READING
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