Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects

@article{Ajami2005ModelingAA,
  title={Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects},
  author={Amir H. Ajami and Kaustav Banerjee and Massoud Pedram},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
  year={2005},
  volume={24},
  pages={849-861}
}
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly impact the performance of global on-chip interconnects. This paper presents a detailed modeling and analysis of the interconnect performance degradation due to the nonuniform temperature profiles that are encountered along long metal interconnects as a result of existing thermal gradients in the underlying Silicon substrate. A nonuniform temperature-dependent distributed RC interconnect delay model is… CONTINUE READING
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Static temperature distribution in IC chips with isothermal heat sources

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