Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects

  title={Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects},
  author={Amir H. Ajami and Kaustav Banerjee and Massoud Pedram},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly impact the performance of global on-chip interconnects. This paper presents a detailed modeling and analysis of the interconnect performance degradation due to the nonuniform temperature profiles that are encountered along long metal interconnects as a result of existing thermal gradients in the underlying Silicon substrate. A nonuniform temperature-dependent distributed RC interconnect delay model is… CONTINUE READING
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Static temperature distribution in IC chips with isothermal heat sources

  • A. A. Bilotti
  • IEEE Trans. Electron Devices, vol. ED-21, no. 3…
  • 1974
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