Modeling and Evaluating Leadframe CSPs for RFICs in Wireless Applications

The electrical models of lead-frame plastic CSPs (Chip Scale Packages) for RFICs have been established based on the S-parameter measurement. To evaluate their RF performance, an on-chip 50 ohm microstrip line was housed in a 32-pin BCC (Bump Chip Carrier) package. The insertion and return losses were calculated against frequency and compared to measurement… (More)