Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

@article{Mondal2017ModelingAC,
  title={Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding},
  author={Saikat Mondal and Sang-Bock Cho and Bruce C. Kim},
  journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems},
  year={2017},
  volume={25},
  pages={308-318}
}
In this paper, we present a novel through-silicon-via (TSV)-based 3-D inductor structure with ground TSV shielding for better noise performance. In addition, a circuit model is proposed for the inductor, which can reduce the simulation time over finite-element-based 3-D full-wave simulation. Rigorous 3-D full-wave simulation is performed up to 10 GHz to validate the circuit model. The ground TSV-based 3-D inductor is found to be resilient to TSV-TSV crosstalk noise compared with conventional 3… CONTINUE READING
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High frequency scalable modeling of a through silicon via (TSV) and proposal of a failure detection method of 3D ICs

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