Modeling and Application of Multi-Port TSV Networks in 3-D IC

@article{Yao2013ModelingAA,
  title={Modeling and Application of Multi-Port TSV Networks in 3-D IC},
  author={Wei Yao and Siming Pan and Brice Achkir and Jun Fan and Lei He},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
  year={2013},
  volume={32},
  pages={487-496}
}
Through-silicon-via (TSV) enables vertical connectivity between stacked chips or interposer and is a key technology for 3-D integrated circuits (ICs). While arrays of TSVs are needed in 3-D IC, there only exists a frequency-dependent resistance, inductance, conductance and capacitance circuit model for a pair of TSVs with coupling between them. In this… CONTINUE READING

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