Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages

Abstract

This paper demonstrates, for the first time, an integrated trench-based shielding for electromagnetic interference (EMI) isolation between components in an ultra-miniaturized radio frequency (RF) package. A novel component-level shielding structure is explored and developed using metallized trenches formed in the build-up layers of ultra-thin glass… (More)

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Cite this paper

@article{Sitaraman2015ModelingDA, title={Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages}, author={Srikrishna Sitaraman and Junki Min and Markondeya Raj Pulugurtha and Min Suk Kim and Venky Sundaram and Rao R. Tummala}, journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)}, year={2015}, pages={1956-1960} }