Mitigating lifetime underestimation: A system-level approach considering temperature variations and correlations between failure mechanisms

Abstract

Lifetime (long-term) reliability has been a main design challenge as technology scaling continues. Time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI), and electromigration (EM) are some of the critical failure mechanisms affecting lifetime reliability. Due to the correlation between different failure mechanisms and… (More)

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