Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs

Abstract

Through-silicon vias (TSVs) in 3-D ICs are a major source of substrate noise, causing performance degradation of neighboring active devices. To reduce this noise, we propose using a tungsten-filled ground plug, a TSV-like structure that connects to ground (GND) and that partially or completely extends through the substrate. We evaluate the impact of plug… (More)
DOI: 10.1109/ISQED.2011.5770813

Topics

12 Figures and Tables

Slides referencing similar topics