Millimeterwave characteristics of flip-chip interconnects for multi-chip modules

  title={Millimeterwave characteristics of flip-chip interconnects for multi-chip modules},
  author={Wolfgang Heinrich and Anja Jentzsch and Guido Baumann},
  journal={1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192)},
  pages={1083-1086 vol.2}
Electromagnetic simulations and measurement data of flip-chip transitions are presented. First-order effects are identified and design criteria for mm-wave multi-chip interconnects are derived. In coplanar environment, the flip-chip scheme provides interconnects with excellent low-reflective properties. For conductor-backed structures, the suppression of parasitic modes represents the key issue. 
Highly Cited
This paper has 55 citations. REVIEW CITATIONS

From This Paper

Figures, tables, and topics from this paper.


Publications citing this paper.
Showing 1-10 of 42 extracted citations

Flip-Chip Approach for 500 GHz Broadband Interconnects

IEEE Transactions on Microwave Theory and Techniques • 2017
View 1 Excerpt

Broadband Packaging of Photodetectors for 100 Gb/s Ethernet Applications

IEEE Transactions on Components, Packaging and Manufacturing Technology • 2013
View 1 Excerpt

Design of a 80 Gbit/s SiGe BiCMOS fully differential input buffer for serial electrical communication

2012 19th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2012) • 2012

55 Citations

Citations per Year
Semantic Scholar estimates that this publication has 55 citations based on the available data.

See our FAQ for additional information.


Publications referenced by this paper.
Showing 1-7 of 7 references

, and J . Wooldridge , " Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules , "

C. Ly Sturdivant, J. Benson
Int . Microwave Symp . Digest • 1997

Modeling millimeter - wave IC behavior for flipped - chip mounting schemes

W. Heinrich Beilenhoff
JEEE Trans . MTT • 1997

Millimeter - wave performance of chip interconnections using wire bonding and flip chip , "

W. Haydl Krems, H. Massler, J. Rudiger
Int . Microwave Symp . Digest • 1996

" 5 1 GHz front - end with flip chip and wire bond interconnections from GaAs MMIC ' s to a planar patch antenna , " 1995

H. Richter, A. Baumgartner, D. Ferling
Int . Microwave Symp . Digest

Improved Finite - Difference formulation in frequency domain for three - dimensional scattering problems "

Beilenhoff, W. Heinrich
EEE Transactions MTT

Rigorous field theory analysis of flip - chip interconnections in MMICs using the FDTLM method , " 1994

R. Vahldieck, H. Minkus, J. Huang
Int . Microwave Symp . Digest

Similar Papers

Loading similar papers…