Millimeterwave characteristics of flip-chip interconnects for multi-chip modules

@article{Heinrich1998MillimeterwaveCO,
  title={Millimeterwave characteristics of flip-chip interconnects for multi-chip modules},
  author={Wolfgang Heinrich and Anja Jentzsch and Guido Baumann},
  journal={1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192)},
  year={1998},
  volume={2},
  pages={1083-1086 vol.2}
}
Electromagnetic simulations and measurement data of flip-chip transitions are presented. First-order effects are identified and design criteria for mm-wave multi-chip interconnects are derived. In coplanar environment, the flip-chip scheme provides interconnects with excellent low-reflective properties. For conductor-backed structures, the suppression of parasitic modes represents the key issue. 
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