Milestones in deep reactive ion etching

@article{Laermer2005MilestonesID,
  title={Milestones in deep reactive ion etching},
  author={F. Laermer and A. Urban},
  journal={The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.},
  year={2005},
  volume={2},
  pages={1118-1121 Vol. 2}
}
  • F. Laermer, A. Urban
  • Published 2005
  • Materials Science
  • The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.
  • Deep reactive ion etching (DRIE) has virtually changed MEMS. The basic technology originally developed at Bosch overcomes design restrictions and compatibility problems related to the old wet-etching technology. Today, after a decade of "Bosch DRIE" in the field, a large variety of new MEMS devices is fabricated using this technology, and a broad DRIE-equipment supplier base is supporting costumer needs all over the world. The paper is telling the milestones from early development of the basic… CONTINUE READING

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