Milestones in deep reactive ion etching

@article{Laermer2005MilestonesID,
  title={Milestones in deep reactive ion etching},
  author={Franz Laermer and Andrea Urban},
  journal={The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.},
  year={2005},
  volume={2},
  pages={1118-1121 Vol. 2}
}
  • F. Laermer, A. Urban
  • Published 5 June 2005
  • Engineering
  • The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.
Deep reactive ion etching (DRIE) has virtually changed MEMS. The basic technology originally developed at Bosch overcomes design restrictions and compatibility problems related to the old wet-etching technology. Today, after a decade of "Bosch DRIE" in the field, a large variety of new MEMS devices is fabricated using this technology, and a broad DRIE-equipment supplier base is supporting costumer needs all over the world. The paper is telling the milestones from early development of the basic… 

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