Microvia Fill Ratio Control

@article{Tenno2007MicroviaFR,
  title={Microvia Fill Ratio Control},
  author={Robert Tenno and Antti Pohjoranta},
  journal={2007 IEEE International Symposium on Industrial Electronics},
  year={2007},
  pages={153-156}
}
A control law for microvia fill process optimization is proposed in this paper. The law enables linear growth of either microvia fill ratio by applying nonlinear control of cell voltage or plating current density, implemented as a set point trajectory for a potentiostat or galvanostat, respectively. Linear deposit growth enables accurate prediction of plating duration and end time. The control system is simulated and compared with results of via fill tests. 

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Microvia fill process control

  • Int. J. Control
  • 2009
VIEW 5 EXCERPTS
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HIGHLY INFLUENCED

Modelling of Surfactant Mass Balance for Microvia Fill Monitoring

  • 2007 International Symposium on High Density packaging and Microsystem Integration
  • 2007
VIEW 2 EXCERPTS
CITES BACKGROUND

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