Microstructures and properties of alumina/copper joints fabricated by ultrasonic-assisted brazing for replacing DBC in power electronics packaging

Abstract

Direct Bonded Copper (DBC) is now commonly applied as heat transfer substrates for high power electronics. The metallizaed surfaces are designed for improving the heat conduction and joining with copper heat sink. However, due to the mismatch of coefficient of thermal expansion, the joining area is usually the failure regions. In the present work, the… (More)

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