Microstructure evolution and thermomechanical fatigue of solder materials

@inproceedings{Vellinga2005MicrostructureEA,
  title={Microstructure evolution and thermomechanical fatigue of solder materials},
  author={Willem P Vellinga},
  year={2005}
}
The coarsening of Pb-rich αPb domains in eutectic Sn-Pb solder during isothermal annealing has been studied in some detail. The importance of anisotropy and of coalescence events and the occurrence of a dynamic scaling regime are discussed. Orientation imaging microscopy reveals the presence of the following two distinct crystallographic orientations between αPb and βSn lamellae in quenched eutectic SnPb solder: [001]αPb ‖ [101]βSn and (010)αPb ‖ (111)βSn ; [111]αPb ‖ [010]βSn and (1̄10)αPb… CONTINUE READING

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References

Publications referenced by this paper.
Showing 1-7 of 7 references

Design and reliability of solder and solder interconnections. The minerals, metals and materials society

J. W. Morris, H. L. Reynolds
1997

Physical properties of crystals

J. F. Nye
1985

Single crystal elastic constants and calculated aggregate properties: A Handbook

G. Simmons, H. Wang
1971

Structure of metals

C. S. Barrett
1962

A handbook of lattice spacings and structure of metals and alloys

W. B. Pearson
1958

Constitution of Binary Alloy. McGraw-Hill, NY

M. Hansen
1958

The elastic constants of crystals

H. B. Huntington
1958

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