Microstructure evolution and thermomechanical fatigue of solder materials

  title={Microstructure evolution and thermomechanical fatigue of solder materials},
  author={Willem P Vellinga},
The coarsening of Pb-rich αPb domains in eutectic Sn-Pb solder during isothermal annealing has been studied in some detail. The importance of anisotropy and of coalescence events and the occurrence of a dynamic scaling regime are discussed. Orientation imaging microscopy reveals the presence of the following two distinct crystallographic orientations between αPb and βSn lamellae in quenched eutectic SnPb solder: [001]αPb ‖ [101]βSn and (010)αPb ‖ (111)βSn ; [111]αPb ‖ [010]βSn and (1̄10)αPb… CONTINUE READING

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