Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

@article{Choubey2008MicrostructureAI,
  title={Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging},
  author={Anshul Choubey and Michael Osterman and M. G. Pecht},
  journal={IEEE Transactions on Device and Materials Reliability},
  year={2008},
  volume={8},
  pages={160-167}
}
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin-lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching… CONTINUE READING