Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

@article{Lehman2005MicrostructureAD,
  title={Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints},
  author={L. Lehman and R. K. Kinyanjui and Jin Wang and Yangchuan Xing and L. Zavalij and Peter Borgesen and E. Cotts},
  journal={Proceedings Electronic Components and Technology, 2005. ECTC '05.},
  year={2005},
  pages={674-681}
}
The implementation of no-Pb soldering is progressing rapidly, often without immediately obvious problems. However, our current understanding of pertinent materials issues is far from sufficient to prevent surprises, and potentially serious miscalculations. The fundamentally different nature of no-Pb from SnPb solder joints has serious consequences for the design and interpretation of accelerated tests. The present work addresses the behavior of ball grid array (BGA), wafer level chip scale… CONTINUE READING

Citations

Publications citing this paper.
Showing 1-10 of 13 extracted citations

References

Publications referenced by this paper.
Showing 1-10 of 15 references

Cotts, “Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder

  • L. P. Lehman, S. N. Athavale, +10 authors E.J.P. Borgesen
  • J. Electronic Materials
  • 2004
8 Excerpts

SnNi and SnNiCu Intermetallic Compounds Found When Using SnAgCu Solders”, IPC/Soldertec

  • T. Gregorich, P Holmes., J. Lee, C. Lee
  • Global 2nd Int. Conf. on Lead Free Electronics,
  • 2004
1 Excerpt

, Yasunori Hirata and Masahisa Otsuka & " Mechanical Fatigue Characteristics of Sn 3 . 5 AgX ( X = Bi , Cu , Zn and In ) Solder Alloys

  • Yoshiharu Kariya
  • Materials Transactions
  • 2001

Cotts, “The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of Microstructure,

  • Zribi, L. Zavalij, P. Borgesen, J E.
  • Symposium Y, Proceedings of the Fall Meeting of…
  • 1999
2 Excerpts

Solidification of Pb Particles Embedded in Al ”

  • K. I Zhang Moore, L D., B Cantor
  • Journal of Electronic Materials
  • 1999

, P . Borgesen , and E . J . Cotts , “ The Growth of Intermetallic Compounds at SnAg - Cu Solder / Cu and SnAg - Cu Solder / Ni Interfaces and the Associated Evolution of Microstructure

  • L. Zavalij Zribi
  • Symposium Y , Proceedings of the Fall Meeting of…

; “ Orientation Imaging Studies of Sn - Based Electronic Solder Joints ”

  • A. U Telang, T. R Bieler, S Choi, K. N Subramanian
  • Journal of Materials Research

Similar Papers

Loading similar papers…