Microstructural evaluation and failure analysis of Ag wire bonded to Al pads

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@article{Choi2015MicrostructuralEA, title={Microstructural evaluation and failure analysis of Ag wire bonded to Al pads}, author={Mi-Ri Choi and Hyung-Giun Kim and Taeg-Woo Lee and Young-Jun Jeon and Yong-Keun Ahn and Kyo-Wang Koo and You-Cheol Jang and So-Yeon Park and Jae-Hak Yee and Nam-Kwon Cho and Il-Tae Kang and Sangshik Kim and Seung-Zeon Han and Sung-Hwan Lim}, journal={Microelectronics Reliability}, year={2015}, volume={55}, pages={2306-2315} }