Microprobing the mechanical effects of varying dielectric porosity in advanced interconnect structures

Abstract

Chip-package interaction has become a major concern due to increasingly porous low-K dielectrics. During the packaging process, shear stresses are exerted on fragile interconnect structures. We use a microprobe metrology system to experimentally measure how interconnect stacks with different dielectric porosities behave under various shear loading… (More)

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7 Figures and Tables