Micromachined High-Q Inductors in 0 . 18 μ m Cu Interconnect Low-K CMOS Process

  title={Micromachined High-Q Inductors in 0 . 18 μ m Cu Interconnect Low-K CMOS Process},
  author={Hasnain Lakdawala and Xu Zhu and Hao Luo and Suresh Santhanam and Rick Carley and Gary K. Fedder},
Spiral inductors fabricated in a 0.18μm 6-level Cu interconnect low-K dielectric process suspended 100μm above the substrate with sidewall oxide removed are described. A maskless post-CMOS micromachining process has been developed for the low-K dielectric copper interconnect process. Post-CMOS process enhancements of inductors provide higher quality factors and self-resonant frequencies by undercutting silicon to eliminate substrate losses and etching inter-turn dielectrics to reduce self… CONTINUE READING
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Publications referenced by this paper.
Showing 1-7 of 7 references

Approximate analytical modeling of current crowding effects in multi-turn spiral inductors

2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096) • 2000
View 1 Excerpt

Characterization of a bulk-micromachined post-process module: for silicon RF technology

2000 Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (Cat. No.00EX397) • 2000
View 2 Excerpts

Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low loss substrates,” IEEE Transaction on Microwave theory and techniques, Vol

J. N. Burghartz, D. C. Edelstein, K. A. Jenkins, Y. K. Kwark
45, No. 10, October • 1997
View 1 Excerpt


J.Y.C. Chang
A. Abidi, and M.Gaitan, “Large suspended inductors on silicon and their use in a 2 μm CMOS RF amplifier,” IEEE Electron Device Letters, Vol. 14, No. 5, May • 1993
View 1 Excerpt

Spiral inductors and transmission lines in silicon technology using copper - damascene interconnects and low loss substrates

D. C. Edelstein J. N. Burghartz, K. A. Jenkins, Y. K. Kwark
IEEE Transaction on Microwave theory and techniques