Microfluidic Cooling for Distributed Hot-Spots

2.5D/3D Stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads to a serious heat dissipation challenge. Micro-channels based microfluidic cooling, embedded in the interposer or different layers of 3D IC, targeting at i nserting heat sink into each layer, can considerably shorten the heat transfer path and thereby… CONTINUE READING