Microfabrication of 3D terahertz circuitry

@article{Mann2003MicrofabricationO3,
  title={Microfabrication of 3D terahertz circuitry},
  author={C. Mann and P. J. de Maagt and George McBride and Femke M van de Water and D. Castiglione and A. McCalden and L. Deias and June O'Neill and Alexandre Laisne and J. M. Salazar Vallinas and I{\~n}igo Ederra and David Haskett and David Jenkins and Andreas Zinn and Marc Ferlet and Ruben Edeson},
  journal={IEEE MTT-S International Microwave Symposium Digest, 2003},
  year={2003},
  volume={2},
  pages={739-742 vol.2}
}
Advances in micro-fabrication techniques combined with accurate simulation tools has provided the means for the realisation of complex terahertz circuitry. Silicon micro-machining provides the way forward to fabricate accurate rugged structures. Multi-level deep reactive ion etching can be used to replace traditional machining methods achieving smaller feature size, improved surface finish and greater freedom in circuit layout. Photonic Bandgap waveguides enable three dimensional arrangements… CONTINUE READING
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