Micro-Scale Solder Joints between Cu-Cu Wires Formed by Nanoparticle Enabled Lead-Free Solder Pastes


Micro-scale solder joints have been formed between copper-copper (Cu-Cu) wires by nanoparticle enabled lead-free solder pastes. Tin-based alloy nanoparticles (Sn-In) have been synthesized by using a surfactant-assisted chemical reduction method. The solder nanoparticles were characterized for size and composition by scanning electron microscopy (SEM… (More)


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