Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling

@inproceedings{A2001MicroMechanicsOF,
  title={Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling},
  author={A.. and Dasgupta and P................... and Sharma and K. and UPADHYAYULA},
  year={2001}
}
This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic plasticity and cyclic creep in eutectic Pb-Sn solder. The issue of damage evolution is deferred to a future paper. Fatigue damage model due to cyclic plasticity is modeled with dislocation mechanics. A conceptual framework is provided to quantify the influence of temperature on fatigue damage due to cyclic plasticity. Damage mechanics due to cyclic creep is modeled with a void nucleation model… CONTINUE READING

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