Method for monitoring low emissivity of wafer

@inproceedings{2015MethodFM,
  title={Method for monitoring low emissivity of wafer},
  author={李云霞 and 张凌越 and 刑彦召},
  year={2015}
}
The invention brings forward a method for monitoring low emissivity of a wafer. Dielectric layers and polysilicon layers are formed on the front surface (the first surface) and the back surface (the second surface) of a silicon chip, then the polysilicon layer and the dielectric layer which are disposed on the front surface of the silicon chip are removed, next, ion implantation is carried out on the front surface of the silicon chip, and then a rapid annealing process is performed on the… CONTINUE READING

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