Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.

@article{Hu2010MeniscusconfinedTE,
  title={Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds.},
  author={Jie Hu and Min-Feng Yu},
  journal={Science},
  year={2010},
  volume={329 5989},
  pages={313-6}
}
Continued progress in the electronics industry depends on downsizing, to a few micrometers, the wire bonds required for wiring integrated chips into circuit boards. We developed an electrodeposition method that exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to "write" pure copper and platinum three-dimensional structures of designed shapes and sizes in an ambient air environment. We demonstrated an automated wire-bonding process that enabled wire diameters of… CONTINUE READING
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Wire Bonding in Microelectronics (McGrawHill

  • G. Harman
  • New York,
  • 2009

Electronic Packaging and Interconnection Handbook (McGraw-Hill

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