Mechanical test for vapor phase solder joint

  title={Mechanical test for vapor phase solder joint},
  author={G. Dumitru and Alexandru Tudor and Sorin Cananau and Ioan Plotog and Gaudenţiu Vărzaru},
  journal={2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)},
The goal of present paper is to describe some aspects regarding the mechanical properties of the lead-free solder joint connections obtained by using the vapor phase soldering technology. In order to highlight the mechanical properties of solder joints in correlation with different pad finishes and different solder paste composition, there were performed… CONTINUE READING