Mechanical degradation of microelectronics solder joints under current stressing

@inproceedings{Ye2003MechanicalDO,
  title={Mechanical degradation of microelectronics solder joints under current stressing},
  author={Hua Hu Ye and Cemal Basaran and Douglas C. Hopkins},
  year={2003}
}
Abstract Understanding the mechanical degradation of microelectronic solder joints under high electric current stressing is an important step to develop a damage mechanics model in order to predict the reliability of a solder joint under such loading. In this paper, the experiment results for flip chip solder joints under high current stressing are reported. Nano-indentation tests suggest that mechanical property, e.g. Young’s modulus, degrades in the localized area where void nucleates during… CONTINUE READING
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