Mechanical constitutive properties of a bi-rich high temperature solder alloy

@article{Jiang2016MechanicalCP,
  title={Mechanical constitutive properties of a bi-rich high temperature solder alloy},
  author={Qian Jiang and Subrata Mukherjee and Abhijit Dasgupta and Daniel A. Shaddock and Liang Yin},
  journal={2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
  year={2016},
  pages={1236-1239}
}
  • Qian Jiang, Subrata Mukherjee, +2 authors Liang Yin
  • Published in
    15th IEEE Intersociety…
    2016
  • Engineering
  • BiAgX is one of the potential lead-free substitutes for lead-rich solders for high temperature interconnections, with a melting temperature above 533K after reflow. This study focuses on the mechanical properties of a particular BiAgX solder alloy. These properties are compared to a selected lead-rich solder for reference. The paste for this solder is in the form of mixed solder powder alloys and the reflow process is done in a vacuum oven to prevent oxidation and to minimize voids. The… CONTINUE READING

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