Mechanical Properties of 3 CSiC Films for MEMS Applications

  title={Mechanical Properties of 3 CSiC Films for MEMS Applications},
  author={Jayadeep Deva Reddy and Alex A. Volinsky and Christopher L. Frewin and Chris Locke and S. E. Saddow},
There is a technological need for hard thin films with high elastic modulus and fracture toughness. Silicon carbide (SiC) fulfills such requirements for a variety of applications at high temperatures and for high-wear MEMS. A detailed study of the mechanical properties of single crystal and polycrystalline 3C-SiC films grown on Si substrates was performed… CONTINUE READING