Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects.

@article{Chiodarelli2011MeasuringTE,
  title={Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects.},
  author={Nicolo' Chiodarelli and Sugiura Masahito and Yusaku Kashiwagi and Yunlong Li and Kai Arstila and Olivier Richard and Daire J. Cott and Marc Heyns and Stefan De Gendt and Guido Groeseneken and Philippe M. Vereecken},
  journal={Nanotechnology},
  year={2011},
  volume={22 8},
  pages={085302}
}
Carbon nanotubes (CNT) are known to be materials with potential for manufacturing sub-20 nm high aspect ratio vertical interconnects in future microchips. In order to be successful with respect to contending against established tungsten or copper based interconnects, though, CNT must fulfil their promise of also providing low electrical resistance in integrated structures using scalable integration processes fully compatible with silicon technology. Hence, carefully engineered growth and… CONTINUE READING
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