Measurements of Young’s Modulus, Poisson’s Ratio, and Tensile Strength of Polysilicon

  title={Measurements of Young’s Modulus, Poisson’s Ratio, and Tensile Strength of Polysilicon},
  author={Norman Sharpe and Bin Yuan and Ranji Vaidyanathan and R. L. Edwards},
New techniques and procedures are described that enable one to measure the mechanical properties of polysilicon films that are 3.5 pm thick. Polysilicon is deposited onto a silicon substrate which is then etched away to leave a tensile specimen in the middle of the die. The grip ends of the structure are glued to the grips of a linear air bearing attached to a piezoelectrically actuated loading system. Strain is measured directly on the specimen with laser interferometry. The specimens are… CONTINUE READING
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Publications referenced by this paper.
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1996,“Measurements of Fracture Strength and Young’s Modulus of Surface-micromachined Polysilicon,

  • D. T. Read, J. C. Marshall
  • Microlithography and Metrology in Micromachining…
  • 1996

1996,“Mechanical Properties of Thick, Surface Micromachined Polysilicon Films

  • H. Kahn, S. Stemmer, +4 authors M. A. Huff
  • The Ninth Annual International Workshop on Micro…
  • 1996

Measurements of Fracture Strength and Young ’ s Modulus of Surface - micromachined Polysilicon

  • S. Stemmer, K. Nandakumar, A. H. Heuer, R. L. Mullen, R. Ballarini, M. A. Huff
  • Microlithography and Metrology in Micromachining…
  • 1996

New Test Structures and Techniques for Measurement of Mechanical Properties of MEMS Materials,

  • W. N. Sharpe, Jr., B. Yuan, R VaidyanathanK., R. L. Edwards
  • Proceedings SPIE Symposium on Micromachining and…
  • 1996

Fracture Strength of Doped and Undoped Polysilicon,” Transducers ‘95-Eurosensors IX, Proceedings of the 8th International Conference on Solid-state Sensors and Actuators, and Eurosensors IX

  • M. Biebl, H. V. Philipsborn
  • 1995

Micromechanics Compatible with an 0.8 mm CMOS Process,

  • M. Biebl, T. Scheiter, C. Hierold, H. V. Philipsborn, H. Klose
  • Sensors and Actuators A,
  • 1995

Variations in Young’s Modulus and Intrinsic Stress of LPCVD-Polysilicon due to HighTemperature Annealing,

  • D. Maier-Schneider, J. Maibach, E. Obermeir, D. Schneider
  • Journal of Micromechanics and Microengineering,
  • 1995

Young’s Modulus of In Situ Phosphorus-Doped Polysilicon,

  • M. Biebl, G. Brand, R. T. Howe
  • Transducers ‘95-Eurosensors IX, Proceedings of…
  • 1995

Crack Tip Opening Displacement Measurement Techniques,” Experimental Techniaues in Fracture, Society for Experimental Mechanics, Inc., Bethel

  • W. N. Sharpe, Jr.
  • CT, Chapter
  • 1993

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