Material technology for 2.5D/3D package


Packaging material is one of the key components for through-silicon via (TSV) 2.5D/3D package giving a strong impact on the higher density integration and its reliability. We have developed and evaluated our packaging materials by collaborating with 3D system integration program in Interuniversity microelectronics center (IMEC). In this paper, we report the… (More)


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