Material Systems Enable High Density Packaging

  • M. Todd
  • Published 2007 in
    2007 International Symposium on High Density…

Abstract

As electronic packages become increasingly complex, designing and building a cost-effective, robust product in a timely manner has become one of the biggest challenges facing packaging specialists. The increased need for higher silicon density drives packaging engineers to use stacked die (SCSP) and stacked package (POP) configurations. Some of key material… (More)

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