MEMS Vacuum Packaging Technology and Applications

@article{Yufeng2005MEMSVP,
  title={MEMS Vacuum Packaging Technology and Applications},
  author={Jin Yufeng and Zhang Jiaxun},
  journal={2005 6th International Conference on Electronic Packaging Technology},
  year={2005},
  pages={1-5}
}
Many MEMS (micro electro-mechanic systems) parts have to meet the requirements for vacuum packaging. In vacuum packaging, leakage and gas permeation, which affects the normal function of the components, are major problems. Hermetic sealing is one of the most important technologies for reliable vacuum packaging. In this paper, several hermetic sealing technologies for vacuum packaging was presented, including eutectic bonding, adhesive bonding, glass frit bonding, and silicon-glass anodic… CONTINUE READING

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