Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

@article{Iachello2014LumpedPM,
  title={Lumped Parameter Modeling for Thermal Characterization of High-Power Modules},
  author={Marco Iachello and Viviana De Luca and Giuseppe Petrone and Natale Testa and Luigi Fortuna and Giuliano Cammarata and Salvatore Graziani and Mattia Frasca},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2014},
  volume={4},
  pages={1613-1623}
}
Power electronic modules are realized by integrating several semiconductor chips inside one package. In this paper, a new thermal modeling procedure and its application to a power electronic module are presented. The adopted modeling strategy consists of the derivation of numerical thermal impedances by 3-D finite element models, validated by comparison with available experimental data, and of the coefficients identification of the RC passive network, through a specific topology, here… CONTINUE READING