Low-temperature sintering of a nanosilver paste for attaching large-area power chips

@article{Xiao2013LowtemperatureSO,
  title={Low-temperature sintering of a nanosilver paste for attaching large-area power chips},
  author={Kewei Xiao and Susan Luo and Khai D. T. Ngo and G. Lu},
  journal={2013 IEEE International Symposium on Advanced Packaging Materials},
  year={2013},
  pages={192-202}
}
A low-temperature silver sintering technology is emerging as a lead-free die-attach solution for high-reliability packaging of power electronics devices and modules. Sintered chips on substrate are reported to have excellent heat dissipation and capability of working at higher junction temperatures. However, one concerning issue with many of the silver… CONTINUE READING