Low-temperature low-pressure die attach with hybrid silver particle paste

@article{Suganuma2012LowtemperatureLD,
  title={Low-temperature low-pressure die attach with hybrid silver particle paste},
  author={K. Suganuma and S. Sakamoto and N. Kagami and D. Wakuda and K. S. Kim and M. Nogi},
  journal={Microelectronics Reliability},
  year={2012},
  volume={52},
  pages={375-380}
}
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