Low temperature bonded Cu/LCP materials for FPC and its characteristics

@article{Nanbu2004LowTB,
  title={Low temperature bonded Cu/LCP materials for FPC and its characteristics},
  author={Kouji Nanbu and Sentaro Ozawa and Kentaro Yoshida and Kenji Saijo and Tadatomo Suga},
  journal={4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004.},
  year={2004},
  pages={126-131}
}
New cladding process has been developed by means of a Surface Activated Bonding (SAB) technique. In this process, Surfaces of materials to be bonded are immediately cleaned, activated by Ar ion sputter etching, and rolled with low distortion at room temperature in vacuum [1]. It is found that this process is available not only for cladding metals but also… CONTINUE READING