Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology

@article{Choudhury2010LowTL,
  title={Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology},
  author={Abhishek Choudhury and Nitesh Kumbhat and Pulugurtha Markondeya Raj and Rongwei Zhang and Venky Sundaram and Rajiv Dunne and Mario Bolanos-Avila and C. P. Wong and Rao R. Tummala},
  journal={2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)},
  year={2010},
  pages={350-356}
}
In a continuous drive to achieve low form-factor packages, chip-to-package interconnections have evolved from the conventional solders to a more hybrid technology consisting of copper and solder. However, scaling down the bump pitch to increase the interconnect density poses serious reliability and yield issues. In the previous, a low-profile interconnect architecture, ~20µm total height, was demonstrated comprising of copper-to-copper interconnection and novel adhesive materials. This paper… CONTINUE READING
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