Low-loss passive components on BCB-based 3D MMIC technology

@article{Nishikawa2001LowlossPC,
  title={Low-loss passive components on BCB-based 3D MMIC technology},
  author={Kenjiro Nishikawa and Suehiro Sugitani and Kojiro Inoue and Takeshi Ishii and Kenji Kamogawa and Belinda Piernas and K. Araki},
  journal={2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157)},
  year={2001},
  volume={3},
  pages={1881-1884 vol.3}
}
This paper proposes low-loss passive components that use newly developed trench-type transmission line together with BCB-based 3D MMIC technology. The trench-type transmission lines and via holes for 3D interconnection are fabricated simultaneously. The trench-type lines effectively reduce the transmission loss of passive components due to their high metal volume, resulting in high performance 3D MMICs. They are especially suitable for low frequency applications in which loss reduction is… CONTINUE READING

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