Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy

@inproceedings{Shi2000LowCF,
  title={Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy},
  author={X. Q. Shi and Hai Long Pang and Weixing Zhou and Zheng Ping Wang},
  year={2000}
}
Low cycle isothermal mechanical fatigue testing of a eutectic alloy 63Sn/37Pb was carried out in a systematic manner over a wide range of frequencies (10 –1 Hz) and temperatures ( 240 to 150°C) with the total strain set at different values (1–50%). The low cycle fatigue behavior of the eutectic solder was found to be strongly dependent on test temperature and frequency. If the Coffin–Manson model is used to describe such fatigue behavior, the fatigue exponent m and ductility coefficientC in the… CONTINUE READING
Highly Cited
This paper has 44 citations. REVIEW CITATIONS

Citations

Publications citing this paper.
Showing 1-10 of 29 extracted citations

Effects of microstructure on thermal fatigue life prediction of solder joints

2012 14th International Conference on Electronic Materials and Packaging (EMAP) • 2012
View 3 Excerpts

Isothermal shear fatigue mechanism of lead free solder joints

2012 IEEE 62nd Electronic Components and Technology Conference • 2012

Low cycle fatigue tests on low carbon steel

2011 International Conference on Business Management and Electronic Information • 2011

References

Publications referenced by this paper.
Showing 1-5 of 5 references

Scripta Mater 1999;41:289

XQ Shi, HLJ Pang, W Zhou, ZP. Wang
1999
View 1 Excerpt

IEEE Trans CPMT—Part A 1996;19:669

DJ Xie, YC Chan, JK. Lai
1996

Sensing Modeling and Simulation in Emerging Electronic Packaging 1996;17:39

BZ Hong, TD Yuan, L. Burrell
1996
View 1 Excerpt

Metall Trans 1988;19A:1051

S Vaynman, ME Fine, DA. Jeannotte
1988

Brazing and Soldering 1986;11:45

HD Solomon
1986
View 1 Excerpt

Similar Papers

Loading similar papers…