Low ball BGA: a new concept in thermoplastic packaging

  title={Low ball BGA: a new concept in thermoplastic packaging},
  author={Ken Gilleo and Javier Belmonte and Gerald Pham-Van-Diep},
  journal={IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585)},
Area array packaging has advanced to become a vital and enabling technology. It has replaced perimeter-restrictive designs where space efficiency and high performance are important. But this type of package has brought a cost penalty. The package substrate has the highest cost component of the ball grid array (BGA). The problem is how to reduce the cost of the substrate? Now add the challenge of producing a cavity style design for the rapidly expanding MEMS (microelectromechanical systems) and… CONTINUE READING
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