Low ball BGA: a new concept in thermoplastic packaging

@article{Gilleo2004LowBB,
  title={Low ball BGA: a new concept in thermoplastic packaging},
  author={Ken Gilleo and Javier Belmonte and Gerald Pham-Van-Diep},
  journal={IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585)},
  year={2004},
  pages={345-354}
}
Area array packaging has advanced to become a vital and enabling technology. It has replaced perimeter-restrictive designs where space efficiency and high performance are important. But this type of package has brought a cost penalty. The package substrate has the highest cost component of the ball grid array (BGA). The problem is how to reduce the cost of the substrate? Now add the challenge of producing a cavity style design for the rapidly expanding MEMS (microelectromechanical systems) and… CONTINUE READING
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Showing 1-5 of 5 references

What Quiet Revolution?

  • K. Gilleo
  • Circuits Assembly,
  • 2004

MEMS Packaging Solutions

  • K. Gilleo
  • EP & P,
  • 2000

MOEMS the Word

  • K. Gilleo
  • Circuits Assembly,
  • 2000

Low Cost CCD Packaging

  • Wetzel, Keith
  • USP 6,011,294, filed April
  • 1996

Handbook of Epoxy Resins, Mc_Graw-Hill NY 1967 Cookson/Alpha-Fry ran JEDEC moisture level measurements on sealed packages

  • H. Lee, K. Neville
  • 1967

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